Non Silicone Thermal Putty - t-global


Description

Gels or thermal pastes already polymerized and directly applicable (fully cured silicone-free single-component products).
These materials can be packaged:

  • in syringe: 30ml / 60ml to be applied with a specific gun
  • in jar: 78g / 143g / 1kg to apply with a spatula

These solutions are very efficient and easy to use (no mixing to be carried out).
Under normal conditions of use, the product retains its initial state (does not dry out, harden or melt). This makes it possible to offer a stable and efficient solution over time.

 

SETTINGS UNITS TG-NSP25 TEST
Thermal conductivity
[W / mK]
2.6 ASTM D5470
Composition
[-]
One part
-
Color
[-]
GRAY
Visual
Viscosity (0.5 rpm)
[Not]
5000
Brookfield
Density
[g / cmᵌ]
2.6 ASTM D792
Resistivity
[ohm.m]
1014 ASTM D257
Operating temperature
[° C]
-50 ° C ~ + 150 ° C -
Container
[Tupe or Pot]
78g / 143g / 1kg -
Datasheet
[-]
-
Tables given as an indication


For more information, please fill out the "Information request" form.
Supplier and t-global partner.

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