Description
Low-thickness thermal caps with good thermal performance after compression.
This format is extremely easy to implement as long as components with standard packaging are used (TO-220).
In addition to higher thermal conduction, these caps provide electrical insulation and a buffer effect.
This format is extremely easy to implement as long as components with standard packaging are used (TO-220).
In addition to higher thermal conduction, these caps provide electrical insulation and a buffer effect.
Tables given as an indication
For more information, please complete the "Request for Information" form.
Supplier and t-global partner.