Description
Module SECO format Q7 à coeur NXP i.MX6
Différentes variantes de processeurs sont disponibles pour ce module, 6S, 6DL, 6D, 6DP et Quad
Processor | NXP i.MX 6 Family, based on Arm® CORTEX-A9 processors i.MX6S Solo - Single core up to 1GHz i.MX6DL Dual Lite - Dual core up to 1GHz per core i.MX6D Dual - Dual core up to 1GHz per core i.MX6DP DualPlus - Dual core up to 1GHz per core i.MX6Q Quad - Quad core up to 1GHz per core |
Max Cores | 4 |
Memory | Up to 4GB DDR3L on-board (up to 2GB with i.MX6S) |
Graphics | Dedicated 2D Hardware accelerator Dedicated 3D Hardware accelerator, supports OpenGL@ ES 2.0 3D Dedicated Vector Graphics accelerator supports OpenVGTM (only i.MX6D, i.MX6DP and i.MX6Q) Enhanced 2D and 3D graphics with i.MX6DP Supports up to 3 independent displays with i.MX6D, i.MX6DP and i.MX6Q Supports 2 independent displays with i.MX6DL and i.MX6S |
Video Interfaces | 1 x LVDS Dual Channel or 2 x LVDS Single Channel 18 / 24 bit interface HDMI Interface 1.4 Video Input Port / Camera Connector |
Video Resolution | LVDS, up to 1920x1200 HDMI, up to 1080p |
Mass Storage | On-board eMMC drive, up to 32 GB SD / MIMIC / SDIO interface 1 x pSD Card Slot on-board 1 x External SATA Channel (only available with i.MX6D and i.MX6Q) |
Networking | Gigabit Ethernet interface |
USB | 1 x USB OTG interface 4 x USB 2.0 Host interfaces |
PCI-e | 1 x PCI-e x1 lane (only PCI-e 1.1 and Gen2 are supported) |
Audio | AC'97 Audio interface I2S |
Serial Ports | 2 x Serial ports (TTL interface) CAN port interface |
Other Interfaces | I2C Bus LPC Bus SM Bus Power Management Signals |
Power Supply | +5VDC ± 5% |
Operating System | Linux Yocto Microsoft® Windows Embedded Compact 7 |
Operating Temperature* | 0°C ÷ +60°C (Commercial version) -40°C ÷ +85°C (Industrial version) |
Dimensions | 70 x 70 mm (2.76" x 2.76") |
