Description
Module SECO au format Q7 à coeur NXP i.MX8X
| Processor | NXP i.MX 8X family SOCs: Dual or Quad Arm Cortex®-A35 Cores + Ix Cortex® M4F core for real-time processing •NXP i.MX8 QuadXplus, 4x Arm Cortex®-A35 Cores + Ix Cortex® M4F core for real-time processing •NXP i.MX8 DualXPus, 2, Arm Cortex®-A35 Cores + Ix Cortexe M4F core for real-time processing •NXP i.MX8 Duax, 2x Arm Cortex®-A35 Cores |
| Max Cores | 4+1 |
| Memory | Soldered down LPDDR4 memory @ 1200MHz, 32-bit interface, up to 4GB |
| Graphics | Embedded GC7000Lite GPU Supports OpenGL 3.0, 2.1, OpenGL ES 3.1, OpenCL 1.2 Full Profile and 1.1, OpenVG 1.1, and Vulkan Embedded VPU, supports HW decoding of HEVC/H.265, AVC/H.264, MPEG-2, VC-1, RV10, VP8, H.263 and MPEG4.2t, HW encoding of AVC/H.264 2 independent displays supported |
| Video Interfaces | Factory alternatives: •2x LVDS Single Channel / 1x LVDS Dual Channel 18-/24-bit interface •LVDS Single Channel 18-/24-bit interface + HMDI interface •eDP 4-lane interface + LVDS single Channel 18-/24-bit interface •eDP 4-lane interface + HMDI interface |
| Video Resolution | MIPI-DSI, LVDS, eDP, HDMI: Up to 1920 x 1080 @ 60Hz |
| Mass Storage | Optional Soldered onboard eMMC 5.1 Drive, up to 64GB SD 4-bit interface QSPI NOR Flash soldered on-board |
| Networking | 1 x Gigabit Ethernet interface On-board WiFi 802.11 a/b/g/n + BT LE 5.0 module, optional |
| USB | 2 x USB 2.0 Host Ports 2 x USB 3.0 Host Ports |
| PCI-e | 1x PCI-e 3.0 x1 port |
| Audio | 1x 12S Audio interface |
| Serial Ports | 1x 4-wires UART |
| CAN | 1x CAN interfaces |
| Other Interfaces | 1x 4-lanes CSI camera interface 2x PWM Up to 8x GPIOs I2C bus SM bus SPI interface Watchdog Boot select signals Power Management Signals |
| Power Supply | +5-10c and +3.3V_RTC |
| Operating System | Linux Android |
| Operating Temperature* | 0°C ÷ +60°C (Commercial version) -40°C ÷ +85°C (Industrial version) |
| Dimensions | 70 x 70 mm (2.76" x 2.76") |
| *Measured at any point of SECO standard heatspreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated. | |
