Module SECO au format Q7 à coeur NXP i.MX8X 

Processor NXP i.MX 8X family SOCs: Dual or Quad Arm Cortex®-A35 Cores + Ix Cortex® M4F core for real-time processing
•NXP i.MX8 QuadXplus, 4x Arm Cortex®-A35 Cores + Ix Cortex® M4F core for real-time processing
•NXP i.MX8 DualXPus, 2, Arm Cortex®-A35 Cores + Ix Cortexe M4F core for real-time processing
•NXP i.MX8 Duax, 2x Arm Cortex®-A35 Cores
Max Cores 4+1
Memory Soldered down LPDDR4 memory @ 1200MHz, 32-bit interface, up to 4GB
Graphics Embedded GC7000Lite GPU
Supports OpenGL 3.0, 2.1, OpenGL ES 3.1, OpenCL 1.2 Full Profile and 1.1, OpenVG 1.1, and Vulkan
Embedded VPU, supports HW decoding of HEVC/H.265, AVC/H.264, MPEG-2, VC-1, RV10, VP8, H.263 and MPEG4.2t, HW encoding of AVC/H.264
2 independent displays supported
Video Interfaces Factory alternatives:
 •2x LVDS Single Channel / 1x LVDS Dual Channel 18-/24-bit interface
 •LVDS Single Channel 18-/24-bit interface + HMDI interface
•eDP 4-lane interface + LVDS single Channel 18-/24-bit interface
•eDP 4-lane interface + HMDI interface
Video Resolution MIPI-DSI, LVDS, eDP, HDMI: Up to 1920 x 1080 @ 60Hz
Mass Storage Optional Soldered onboard eMMC 5.1 Drive, up to 64GB SD 4-bit interface
QSPI NOR Flash soldered on-board
Networking 1 x Gigabit Ethernet interface
On-board WiFi 802.11 a/b/g/n + BT LE 5.0 module, optional
USB 2 x USB 2.0 Host Ports
2 x USB 3.0 Host Ports
PCI-e 1x PCI-e 3.0 x1 port
Audio 1x 12S Audio interface
Serial Ports 1x 4-wires UART
CAN 1x CAN interfaces
Other Interfaces 1x 4-lanes CSI camera interface
2x PWM
Up to 8x GPIOs
I2C bus
SM bus
SPI interface
Boot select signals
Power Management Signals
Power Supply +5-10c and +3.3V_RTC
Operating System Linux
Operating Temperature* 0°C ÷ +60°C (Commercial version)
-40°C ÷ +85°C (Industrial version)
Dimensions 70 x 70 mm (2.76" x 2.76")
*Measured at any point of SECO standard heatspreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.


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